Technical Paper

Context-aware SPICE simulation improves the fidelity of ESD analysis

Dynamic simulation results report next to waveform chart, with arrow connecting numeric voltage output in report to waveform point showing peak voltage for a diode.

Traditional ESD verification using parasitic extraction with SPICE simulation can’t accurately model the dynamic behavior of the circuits in large designs, or provide simulation results in a practical runtime for large blocks or full chips. The Calibre PERC reliability platform context-aware SPICE functionality merges the powerful capabilities of static and dynamic checking, enabling designers to overcome shrinking design margins and tightening schedules while ensuring the fidelity of ESD analysis, regardless of design size.

Innovative context-aware SPICE simulation improves electrostatic discharge analysis for large designs

With the growing complexity, increase in transistor count, and shrinking dimensions of ICs, ESD verification is proving to be a significant challenge at advanced nodes. Traditional ESD verification using parasitic extraction followed by SPICE simulation struggles to accurately model the dynamic behavior of the circuits in large designs, and to provide simulation results in practical runtimes at the large block or full chip level. The Calibre PERC context-aware SPICE simulation brings together the best of both the static and dynamic approaches, combining the physical layout of a component with its electrical implementation, and analyzing that information to evaluate ESD robustness. This context-aware SPICE simulation flow enables designers to achieve accurate ESD analysis for the largest designs at any process node.

Share

相關資訊

使用基於單元的 P2P/CD 驗證評估 ESD 防護強度
Technical Paper

使用基於單元的 P2P/CD 驗證評估 ESD 防護強度

靜電放電 (ESD) 是積體電路 (IC) 設計中存在最久的可靠性問題之一。當兩個帶電荷的物件之間突然發生意外的電流流動時,就會發生 ESD 事件。在 IC 中,ESD 通常是由於電氣短路或介電質崩潰所引起。ESD 事件總是會對電路實體造成損壞,可能導致 device 立即出現故障,或對電路產生不太明顯的減損,以致降低 device 的整體效能和可靠性。

2.5D 與 3D IC 的自動化 ESD 防護驗證
Technical Paper

2.5D 與 3D IC 的自動化 ESD 防護驗證

在 IC 電路設計和驗證中,確保積體電路 (IC) 設計能夠承 受靜電放電 (ESD) 而不造成損壞或故障極為重要。雖然自 動化的 ESD 驗證流程對於一般 2D IC 而言已相當完善, 但 2.5D 和 3D 的整合對 ESD 設計和驗證都帶來了新的 挑戰。雖然有一些設計方法可協助設計師實現 2.5D 和 3D IC 的有效 ESD 防護,但截至目前為止,這些技術明顯 缺乏自動化 ESD 驗證解決方案