The market for electromagnetic simulation continues to increase. The main technology drivers include higher frequencies, decreasing voltage, increasing density, and 3DIC packaging.
PCB designers can now take advantage of high speed, accuracy, and capacity solutions for signal integrity, power integrity, and EMI challenges—all within a common, easy-to-use interface.
This popular white paper focuses on the need for electromagnetic simulation of package-board systems, which is becoming increasingly more complex while time-to-market must remain the same.