Xpedition Enterprise delivers integrated, collaborative, co-design systems connecting IC packaging, multi-board, RF, harness, FPGA, and MCAD to ensure teams have the flexibility and intuitive technologies they need.
Enable a digital thread from requirements through manufacturing
Design teams can minimize rework and improve product quality through multiple disciplines:
- Multi-board design
- Integrated, collaborative, co-design systems connecting IC packaging, multi-board, RF, harness, FPGA and MCAD to ensure teams have the flexibility and intuitive technologies they need.
- ECAD/MCAD Co-design
- Efficient collaboration between the ECAD and MCAD domains so they can optimize their electronics designs within tight form-factor constraints while still meeting quality, reliability, and performance requirements.
- FPGA/PCB Co-design
- I/O optimization technology provides an extensive set of functionality to ease the FPGA-on-board integration process.
- IC Packaging/PCB Co-design
- Monolithic scaling limitations drive the growth of 2.5/3D multi-chiplet, heterogeneous integration that enables PPA targets to be met
- A/D/RF Co-design
- The design and shielding of complex RF circuits. Engineers can enter schematics, optimize layout, and prepare for manufacturing when designing with RF circuits.
- PCB/Harness Co-design
- Scale to support everything from the simplest cable within an electronic box or LRU to complex harnesses connecting LRUs in systems-of-systems designs.
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