Enable a digital thread from requirements through manufacturing
Design teams can minimize rework and improve product quality through multiple disciplines:
Integrated, collaborative, co-design systems connecting IC packaging, multi-board, RF, harness, FPGA and MCAD to ensure teams have the flexibility and intuitive technologies they need.
Efficient collaboration between the ECAD and MCAD domains so they can optimize their electronics designs within tight form-factor constraints while still meeting quality, reliability, and performance requirements.
I/O optimization technology provides an extensive set of functionality to ease the FPGA-on-board integration process.
Monolithic scaling limitations drive the growth of 2.5/3D multi-chiplet, heterogeneous integration that enables PPA targets to be met
The design and shielding of complex RF circuits. Engineers can enter schematics, optimize layout, and prepare for manufacturing when designing with RF circuits.
Scale to support everything from the simplest cable within an electronic box or LRU to complex harnesses connecting LRUs in systems-of-systems designs.
To learn more about digital thread, visit.