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technology overview

Multi-Discipline Systems Engineering - Digital thread

Estimated Watching Time: 2 minutes
Xpedition Enterprise delivers integrated, collaborative, co-design systems connecting IC packaging, multi-board, RF, harness, FPGA, and MCAD to ensure teams have the flexibility and intuitive technologies they need.

Enable a digital thread from requirements through manufacturing

Design teams can minimize rework and improve product quality through multiple disciplines:

  • Multi-board design

    • Integrated, collaborative, co-design systems connecting IC packaging, multi-board, RF, harness, FPGA and MCAD to ensure teams have the flexibility and intuitive technologies they need.

  • ECAD/MCAD Co-design

    • Efficient collaboration between the ECAD and MCAD domains so they can optimize their electronics designs within tight form-factor constraints while still meeting quality, reliability, and performance requirements.

  • FPGA/PCB Co-design

    • I/O optimization technology provides an extensive set of functionality to ease the FPGA-on-board integration process.

  • IC Packaging/PCB Co-design

    • Monolithic scaling limitations drive the growth of 2.5/3D multi-chiplet, heterogeneous integration that enables PPA targets to be met

  • A/D/RF Co-design

    • The design and shielding of complex RF circuits. Engineers can enter schematics, optimize layout, and prepare for manufacturing when designing with RF circuits.

  • PCB/Harness Co-design

    • Scale to support everything from the simplest cable within an electronic box or LRU to complex harnesses connecting LRUs in systems-of-systems designs.

To learn more about digital thread, visit.

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