For successful implementation, semiconductor companies need standardized interface protocols that offer plug-and-play compatibility between chiplet suppliers. With new requirements and signoffs, how do workflows and design tools evolve to meet the new demands and resolve any challenges?
3D IC design workflow focus areas for heterogeneous integration
Five workflow adoption focus areas provide immediate heterogeneous integration capability benefits while establishing a managed methodology adoption and migration process that minimizes disruption, risk, and cost. These focus areas bring heterogeneous integration-based chiplet design within reach of mainstream manufacturers.
The five focus area workflows span several interlinked domain areas:
Design activities (including planning, prototyping, system technology co-optimization, and detailed physical implementation of the substrates)
Learn more about these 3D IC design workflows in the white paper.