white paper

Achieving OSAT and foundry fabrication rules for package substrate outgassing, metal-filled areas and power planes

Tightly coupled return currents flowing on the cross-hatched plane layer underneath the trace.

Dynamic hatched fill, outgassing voids, and dummy metal fill are the most common methods to achieve foundry and OSAT requirements for metal areas and planes in advanced package designs. The key to success lies in choosing the methodology that best meets vendor rules and design power specifications, allows rapid ECO turns, and is repeatable. This paper describes these three methodologies.

Share

Related resources

Xperi®: A Designer’s Life with HLS
Webinar

Xperi®: A Designer’s Life with HLS

This webinar will discuss two aspects of their experience going from RTL to HLS. The first topic is using HLS for algorithms such as Face Detection th

High-Level Synthesis Verification Technologies and Techniques
Webinar

High-Level Synthesis Verification Technologies and Techniques

This session will describe applying known and trusted static, formal and dynamic approaches to verification performed at the C++ or SystemC HLS level of abstraction.

NVIDIA: High-Level Synthesis in Agile System-on-Chip Flows: Overview and Techniques
Webinar

NVIDIA: High-Level Synthesis in Agile System-on-Chip Flows: Overview and Techniques

This talk provides a brief overview of NVIDIA Research’s use of Catapult HLS and highlights some useful features and flows of the Connections library, such as the ability to back-annotate SystemC simulations.