Explore the power of heterogeneous integration in modern device design
A guide to building your 3D digital twin
The integration of chiplets has opened new possibilities for engineers by allowing the assembly of various third-party IPs into advanced packages, resulting in the creation of sophisticated system-in-packages (SiP) that offer enhanced performance, power efficiency, scalability, flexibility, and cost-effectiveness. However, current design tools and methodologies are not optimized for chiplet integration, necessitating a shift towards a system-centric approach for 2.5D/3DIC design.
In the following series of eBooks, we provide a comprehensive methodology and process for chiplet integration, emphasizing system-level technology co-optimization (STCO) through advanced design tools. Our approach enables design engineers to optimize power, performance, area, cost, and reliability across different components, fostering seamless communication and management of heterogeneous data across teams and offering early insights into downstream effects.
The first stage: Building the design
In this eBook, the first of four in the series, we focus on the first stage in heterogeneous chip integration: building the 3D digital twin of the design.
This stage consists of:
- Data aggregation and integration
- Hierarchical device planning of chiplets in collaboration with IC design team
- Assembly-level net list definition and verification
Download the eBook to learn how our methodology and best practices can revolutionize your design process, empowering engineers to reduce dependency on experts and streamline design iterations for enhanced efficiency and innovation.
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