技術文献

Unlocking efficiency: Smart strategies for metal fill extraction

The image shows a layout of signal nets (in blue) and metal fill/floating net (in orange) as part of an IC layout. The layout is divided into multiple sections, each displaying a different pattern of the signal nets and metal fill/floating net.

As semiconductor technology scales and device complexity increases, accurately modeling the parasitic effects of metal fill has become critical for circuit performance, power integrity and reliability. Metal fill is crucial in manufacturing to ensure uniform layer density, improve planarization, thermal management and stress management. However, metal fill structures also introduce parasitic capacitance that can impact circuit behavior. Traditionally, there has been a significant computational challenge in balancing the accuracy of parasitic extraction with the runtime required; treating all metal fill as grounded oversimplifies the model, while extracting all parasitic components is computationally expensive.

This paper discusses the conventional extraction techniques for metal fill shapes in different circuit designs, stating the differences between them and the impact of using each one. An adaptive, smart technique, based on one of these conventional techniques, is also discussed in the paper, detailing what is different about, when it would be best to use and what kind of improvement to expect when using it versus the conventional techniques. This alternative extraction technique that selectively extracts only the most impactful parasitic capacitances from the metal fill, achieving over 4x runtime improvements compared to conventional methods, while maintaining minimal impact on accuracy. The adaptive technique dynamically adjusts the level of detail based on the design context, such as the density of signal nets versus fill shapes. This smart, context-aware solution improves designer efficiency as semiconductor technology continues to scale and design complexity increases.

What you’ll learn:

  • The importance of accurately modeling parasitic effects from metal fill structures in modern IC designs, as they can significantly impact performance, power integrity, and reliability.
  • The tradeoffs between computational complexity and modeling accuracy when it comes to parasitic extraction of metal fill, and the limitations of traditional approaches.
  • How an "adaptive" parasitic extraction technique can selectively focus on the most impactful fill shapes, providing over 4x runtime improvements compared to conventional methods while maintaining minimal impact on accuracy.

Who should read this:

  • IC designers
  • Parasitic extraction engineers
  • Verification engineers
  • CAD managers

共有

関連情報

Quick Teamcenter upgrade testing and load testing using Active Tester – codeless test automation for Teamcenter
Webinar

Quick Teamcenter upgrade testing and load testing using Active Tester – codeless test automation for Teamcenter

Watch this on-demand Realize LIVE session to learn about reducing testing time with a codeless test automation solution for Teamcenter.

Realize LIVE – Explore active reports in Active Workspace
Webinar

Realize LIVE – Explore active reports in Active Workspace

Watch this Realize LIVE on-demand session to learn how to build active reports in Teamcenter’s Active Workspace.

Achieve quality excellence with Teamcenter Quality
Webinar

Achieve quality excellence with Teamcenter Quality

Watch this Realize LIVE on-demand presentation session to stay updated on the latest developments and innovations in the Teamcenter Quality product line.