video

Take the Fast Track with Teamcenter X SaaS PLM

Estimated Watching Time: 18 minutes
SaaS PLM fast track

Want to get up and running quickly with software-as-a-service product lifecycle management (SaaS PLM)? Discover Teamcenter X, the world’s most widely used PLM software that’s easy to use and easy to access.

Success with SaaS PLM in the Cloud

  • Find product information with ease 

  • Manage MCAD and ECAD designs 

  • Manage product-related documents 

  • Manage the cross-domain bill of material (BOM) 

  • Visualize the product across the business 

  • Streamline change and other processes

The Advantages of SaaS PLM in the Cloud

  • Realize the value of the digital twin 

  • Instant-on PLM for fast time-to-value 

  • Grows with you, so you can pay only for what you need 

  • Proven solutions for companies of all size 

  • We drive PLM, so you can drive your business

SaaS PLM Software in the Cloud Supports Everyone, Everywhere

Created with product innovators in mind, Teamcenter X enables companies of all sizes to quickly realize value, without the IT resource traditionally associated with on-premises PLM deployments. Teamcenter X offers the convenience of choosing from pre-configured engineering and business solutions that deliver immediate value, with the flexibility to add more capabilities as business needs grow. Teamcenter X brings the power of the cloud to all users, to help reduce time-to-market and connect distributed, cross-disciplinary teams while improving effectiveness and efficiency at any scale.

Take a free test drive with Teamcenter X on the cloud today!

Share

Related resources

Five key workflows for 3D IC packaging success
White Paper

Five key workflows for 3D IC packaging success

Learn about five workflow focus areas to adopt that provide immediate heterogeneous integration capability benefits needed for mainstream 2.5D and 3D IC chiplet design

Delivering 3D IC innovations faster
E-book

Delivering 3D IC innovations faster

One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the technology scaling and cost limitations of monolithic IC design processes.

System-level connectivity management and verification of 3D IC heterogeneous assemblies
White Paper

System-level connectivity management and verification of 3D IC heterogeneous assemblies

Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built using a different methodology, team, and/or format.