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fact sheet

Xpedition Substrate Integrator

Xpedition Substrate Integrator
Xpedition® Substrate Integrator (xSI) provides a graphical, rapid virtual prototyping environment tuned for the exploration and integration of multiple heterogeneous ICs/chiplets and interposers into High Density Advanced Packages (HDAP).

Key benefits of substrate integrator

  • Rapid planning, prototyping and optimization of 2.5/3D heterogeneously integrated die/chiplets based semiconductor package assemblies

  • System connectivity management and visualization with cross-domain pin/signal mapping/shorting and system-level logical verification

  • User-definable rules for custom optimization of pin and ball-out assignments

  • Single-window visualization and hierarchical management of multi- die/chiplet and substrate assemblies

  • Pin-based interface planning with or without nets

  • Extensive input and output data formats

  • System-level LVS/STA verification through Calibre® 3DSTACK

  • Integration with Xpedition Package Designer and Calibre, for detailed implementation, verification, and signoff

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