fact sheet

Tessent SiliconInsight

Fact Sheet

Tessent SiliconInsight Fact Sheet

As designs increase in complexity, reducing the silicon bring-up phase is critical in getting ICs into the hands of customers. Understanding under what conditions an IC fails and effectively isolating the problem helps design, test, and DFT engineers accelerate debug and characterization.

Share

Related resources

PCB and IC Packaging System Requirements
Fact Sheet

PCB and IC Packaging System Requirements

PCB and IC Packaging System Requirements document defines the minimum requirements necessary for successful operation of software solutions, including processor and operating system requirements.

Managed blocks in design reuse
Fact Sheet

Managed blocks in design reuse

PCB design reuse provides engineers and designers with an efficient method to develop and publish blocks of 'known good' circuitry from schematic and layout tools in new products.

ODB++ Inside for Cadence Allegro User Guide
Technical Paper

ODB++ Inside for Cadence Allegro User Guide

User guide for ODB++ Inside for Cadence Allegro.