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Calibre 3DThermal

Accurate thermal analysis, verification and debug for 3D IC and package designers

Calibre 3DThermal analyzes thermal effects in 3D IC packages
The Calibre 3DThermal tool lets designers perform accurate chip and package-level static or dynamic thermal analysis of the full 3D IC assembly. It combines a customized solver engine from the industry-leading 3D package-level thermal analysis tool, Simcenter Flotherm, and the proven Calibre physical verification platform to perform highly accurate and computationally efficient thermal analysis.

Calibre 3DThermal is part of Calibre's multiphysics verification solution designed to mitigate the complex interplay between thermal impacts, mechanical stress and electrical behavior in 3D IC designs, helping design teams optimize their productivity while improving design quality. With Calibre 3DThermal, designers of 3D ICs now have an integrated chip-package thermal co-design flow that spans early-stage package exploration through design signoff.

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