Reference workflows for Intel Foundry EMIB and EMIB-T integration platforms

Innovator3D IC is the system-level prototyping and planning cockpit for driving the Siemens EDA solution and workflow for the Intel Foundry EMIB integration platform.

What is EMIB?

Embedded multi-die interconnect bridge (EMIB) is a semiconductor packaging technology that uses a small, embedded silicon bridge to interconnect multiple dies, or chiplets, within a single package. Unlike a large silicon interposer, the EMIB bridge only spans the area needed to connect the specific dies, making it a more compact and cost-effective solution. EMIB allows for the integration of multiple dies in a highly integrated system-in-package (SiP), with the ability to have multiple EMIB bridges within a single package. This approach requires tightly coordinated co-design of the dies, EMIB, and overall package architecture to optimize performance and cost, in contrast to the more interface-oriented silicon interposer.

Discover how using Innovator3D IC

• Reduces iterations, development costs, and risks
• Accelerates design and verification
• Improves reliability through increased simulation coverage
• Optimizes design across multiple domains
• Automates multi-discipline verification
• Delivers a proven, integrated, single-vendor solution

The Siemens approach to designing for Intel Foundry’s EMIB integration platform is to define and drive everything from a single digital twin model of the entire advanced package assembly, which is constructed and managed by the Siemens Innovator3D IC solution.