應對軟板和軟硬結合板的設計挑戰
Xpedition® 提供成功完成軟板和軟硬結合板設計和訊號完整性分析所需的一切工具,可引導設計師穿越挑戰的雷區,向第一次設計即成功的目標邁進。
Flex-rigid PCB design challenges
Multiple board outlines, each with separate layer stack-ups
Special layer stack-up constructs that are unique to flex
Special layer types, such as Adhesive, Cover layer, and Stiffener
Bending and folding of the assembly
The 3D aspect of the folded assembly
The need to route along curving boards without causing reliability issues due to metal stress
Plane and shape fills that conform to flex requirements
Design Rule Checking (DRC) that understands specific flex-rigid rules
Signal and Power integrity of a multi stack-up board
Flex fabrication output that safely conveys design intent to FAB
How Xpedition solves the problems
Xpedition gives you the solution that:
makes it easy to set up simple and complex flex and flex-rigid designs
it's safe and easy to implement changes to stack-up and outlines
supports true 3D design and verification
delivers robust non-ambiguous fabrication output
Learn more about Rigid-flex PCB design.