New innovative way to functionally verify heterogeneous 2D/3D package connectivity

Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out to a geometry suitable for connecting to a printed circuit board. The package netlist was often captured by the package designer, typically using Excel to manually assign net names to the desired die bumps and BGA balls to achieve the intended connection.

Modern package and interposer design has become a system integration task: designers have the responsibility to take input from various stake-holders – who are often designing their content at the same time the package or interposer is being designed – and create a design which is both electrically and physically correct and functions as designed.

The 3DKs: 3D IC design enablement

The foundation of successful 3D IC implementation lies in a comprehensive suite of design enablement kits that revolutionize how we approach heterogeneous integration. These 3DKs (3D IC chiplet design kits) —spanning chiplet design, package assembly, materials, and testing—form an interconnected ecosystem that streamlines the entire design-to-manufacturing process. By providing standardized yet flexible frameworks, these 3DKs enable designers to navigate complex multi-vendor scenarios while ensuring manufacturability and performance optimization. The result is a dramatic reduction in design cycles and a clear path to first-time-right manufacturing.

To fully leverage the power of 3DKs, robust authoring tools are essential. These next-generation tools transform complex design specifications into machine-readable formats, enabling seamless integration across the supply chain. With built-in validation capabilities and standardized exchange protocols, they ensure consistency and accuracy throughout the design process. Most importantly, they create a foundation for a true chiplet marketplace, where pre-validated designs can be confidently shared and integrated, accelerating innovation while reducing development costs.

This white paper reveals the critical workflows, ecosystem developments, and breakthrough 3DKs that are making heterogeneous integration accessible and practical. Discover how industry leaders are navigating this transformation and positioning themselves for success in the new era of semiconductor design.

Download the white paper now!