Seiko Epson, a global leader in projector technology, faced a critical challenge: as projectors become smaller and more portable, managing heat from power supplies and lamps becomes increasingly complex. Traditional design approaches alone could not deliver the thermal performance needed to protect sensitive semiconductors in compact housings.
To address this challenge, Seiko Epson’s engineering team used digital simulation with Simcenter FLOEFD software to apply advanced computational fluid dynamics (CFD) and evaluate and optimize cooling concepts earlier in the design process. By integrating thermal simulation, the team developed semiconductor cooling solutions that met performance requirements while reducing design iterations and improving engineering efficiency.
Download this infographic to learn how Seiko Epson used integrated CFD tools to streamline development and improve return on investment.