Simcenter SimLab 3D digital twin for 3D IC advanced IC packaging
A unified multiphysics digital twin to accelerate reliable and efficient 3D IC and advanced packaging design
SimLab, featuring multiphysics and automation capabilities, is designed for 3D integrated circuit (IC) and advanced IC packaging, creating a 3D digital twin of the entire 3D IC system. This integrated process enables early analysis and optimization of heterogeneous packages, addressing power, electromagnetic, thermal, and reliability challenges in a single, unified workflow.
SimLab accelerates analysis, generating quicker, more reliable outcomes. Identify and address potential power and thermal issues early in the design process to streamline development while navigating the complexities of 3D IC design with greater confidence and precision.