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Status of curvilinear data format working group

The industry is moving full speed ahead to enable CL mask tools, data handling, and flows.

Sample evolution of OPC/MPC output polygon over several iterations.
In 2019, we proposed the formation of a data format working group to address the need for curvilinear data representation. The new working group was formed by major semiconductor companies with representations from Siemens EDA, Synopsys, Nippon Control Systems, D2S, Aselta, and ASML-BRION to quantify the curvilinear data volume problem; develop, test and implement new or revised formats based on OASIS; and to formalize the working group as a SEMI task force. In this paper, we introduce the necessity of a new curvilinear data format and the share progress of our task force. We also demonstrate that given the nature of curvilinear data, representing it using native curve formats has significant value to reduce file size for future mask making flows.

为什么选择曲线掩膜？

IC 设计和制造历来将形状表示为曼哈顿形状。直线边多边形是一种高效利用可用空间的方式。圆形和曲线都会浪费空间，但在现实世界中，工艺角总会进行一定程度的圆化。直线边设计之所以会在晶圆上呈现圆化工艺角，主要是投影光学系统的低通性质所致。由于光学/电子束写入机的工艺角分辨率是有限的，直线边设计会在掩膜上呈现圆化工艺角。

下一代光刻工艺的曝光要求促使光刻人员探索曲线掩膜的优势。多光束掩膜写入机 (MBMW) 的问世解决了与高顶点数相关的掩膜写入运行时间损失，并使曲线 (CL) 掩膜的引入更接近于现实。

行业正在全速挺进，寻求全面支持 CL 掩膜工具、数据处理和流程。

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