Recent developments in interconnect technologies have given boost to disaggregated products with either 2.5D or 3D (and beyond) construction. Such products provide unique challenges to testing, while also providing opportunity to test time reduction through test concurrency.
In this presentation, we will present some of the challenges of testing disaggregated parts, testing strategy applied to disaggregated products in Intel client, and the usage of Siemens’ SSN with high-speed IO test port in order to bring down test time and product cost.