Innovative chip-package stress analysis for ICs using Calibre 3DStress

Integrated circuits (ICs) are essential components in many electronic devices, where their reliability and performance can be significantly impacted by mechanical stress during package assembly and soldering processes. This work introduces Calibre 3DStress, a cutting-edge solution for analyzing stress effects. By accepting GDS files as input, the tool automatically generates a mesh, produces a stress map, and facilitates back-annotation to perform electrical simulations that account for stress drift. With advanced features like multi-die and multi-threading capabilities, it ensures efficient and accurate analysis. An illustrative use case demonstrates the tool’s effectiveness, with measurements and simulations showing strong agreement, validating its performance in real-world applications.