As the semiconductor industry shifts from traditional monolithic SoC designs to heterogeneous, disaggregated system-in-package (SiP) architectures, the challenges of validating performance and reliability across chip and package boundaries have grown exponentially. Siemens EDA's Calibre 3DStress tool addresses this critical need by bringing together advanced thermomechanical modeling with the proven capabilities of the Calibre platform.
In this video, Shetha Nolke, Senior Product Manager for Calibre 3DStress, explains how the tool empowers IC and chiplet designers to proactively address mechanical and stress-related issues in the context of full package integration. By combining traditional physical modeling with advanced Calibre verification technology, Calibre 3DStress enables layout design teams to collaborate more effectively with packaging engineers—streamlining both early feasibility analysis and final signoff.
As process nodes shrink, die thickness decreases, and thermal loads increase, making mechanical stress an unavoidable design concern. Traditional workflows that separated chip design from packaging can no longer ensure product reliability or performance. Calibre 3DStress makes this validation workflow seamless, bringing mechanical and electrical perspectives together into a unified tool suite.
Part of the larger Calibre Multiphysics portfolio – which includes Calibre 3DThermal, mPower, and Calibre 3D PERC – Calibre 3DStress helps ensure quality, performance, and reliability across the lifecycle of 3D ICs and advanced SiP designs.