Calibre 3DStress: advanced methodology for assessing IC reliability and performance

Integrated circuits (ICs) are the essential building blocks of modern electronic devices, making it crucial to ensure their reliability and performance. However, these can be compromised by mechanical stress during fabrication processes such as soldering and packaging assembly. To tackle this challenge, ST has integrated Calibre 3DStress into its methodology. This innovative tool starts with an input GDS, generating IP stress maps whose components are back-annotated into electrical simulation. With cutting-edge features like multi-threaded simulations and the ability to handle multiple dies on a single PCB, Calibre 3DStress can address more complex applications. Additionally, a user-friendly interface developed by ST ensures a smooth workflow, allowing users to achieve expected performance quickly and efficiently without extensive technical effort. A compelling case study will be presented to showcase the tool's effectiveness and transformative potential with the aid of advLab, a ST tool, that provides powerful visualization and computation capabilities.