çözüm özeti
Innovator3D IC test
3D design-for-test (DFT), DFT-aware thermal planning, diagnosis and yield
Innovator3D IC test solutions address the critical challenge of thermal hotspots and potential device damage during the testing of multi-die packages, which traditional die-level testing often misses. By providing IEEE 1838-compliant DFT, thermal-aware test scheduling, and advanced power and thermal analysis tools, Siemens enables engineers to prevent overheating, improve reliability, maintain high fault coverage, and accelerate design closure. This integrated and automated workflow ensures guaranteed thermal safety and enhanced test yield across complex 2.5D/3D IC designs, making it an essential tool for robust advanced packaging.