Xpedition IC Packaging VX.2.10 Update 1 Fact Sheet

Xpedition IC Packaging VX.2.10 Update 1 delivers capabilities targeted at the prototyping, planning, and design of next-generation 2.5/3D heterogeneous packages, including enhanced creation and planning of ultra-high pin count devices, cross-substrate system-level predictive SI/PI, and reduced time to achieve an optimized floorplan area.