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What’s new in Xpedition IC Packaging- VX.2.10 Update 3
เวลาอ่าน: 2 นาที
The VX.2.10 Update 3 delivers capabilities targeted at the prototyping, planning, and design of next-generation 2.5/3D heterogeneous packages, including support for ultra-high pin count devices, predictive SI/PI analysis during prototyping and planning, and mixed vendor design flows.