Delivering 3D IC innovations faster
Learn how to engineer a smarter future faster by downloading this ebook.
3D IC heterogeneous systems require co-optimization and co-simulation
Companies wanting to lead the way in 3D heterogenous integrated design must adopt four enabling approaches:
Transition from design-based to systems-based optimization for consistent system representation throughout design
Expanding the supply chain and tool ecosystem requiring interoperability and openness
Balancing design resources across multiple domains with system co-optimization (STCO)
Globalization requires complete system focus and cohesiveness across engineering teams (silicon, packaging and PCB) around the world
Learn how to use the Siemens heterogeneous 3D IC solution to create designs that meet or exceed your PPA goals and improve the differentiation, profitability and time to market of your next market-leading project.
Siemens 3D IC workflows: packed with powerful capabilities
The Siemens 3D IC heterogeneous package workflow catapults you into the future of IC design today, with:
Heterogeneous planning and co-design using prototyping/planning and integration of 3D IC packages enable a full system perspective for STCO-based modeling and early prototyping
Ecosystem interoperability and openness with industry standards, supporting third-party tools, certified reference flows, process design kits (PDK) and assembly design kits (ADK)
Physical verification through industry-proven assembly-level 3D IC verification (DRC/LVS)
Multi-domain testing for 3D IC architectures with known coverage through standards for 3D IC multi-domain testing