Статья
Semiconductor Engineering Article: Preparing for 3D ICs
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More than Moore limitations: preparing for 3D ICs
To prepare for challenges stemming from more than Moore limitations, designers need new methodologies such as 2.5D and 3D IC to meet market demands. The more features and more complex the electronic circuit design, the more processing capability is required. When designers face limitations with what’s available, they can use 2.5D or 3D IC to extend their capabilities. To do so, teams need to re-evaluate their design processes for 3D IC readiness.