relatório técnico

System-level power integrity analysis using the Innovator 3D IC Solution Suite

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Siemens Innovator3D IC solution suite simplifies the complexity of 3D IC design by unifying die-level and package-level power integrity analysis in a single, intuitive environment. This solution enables fast, comprehensive evaluation of SSN, VDD droop, and frequency-dependent impedance across the entire power delivery network.

In advanced multi-die architectures, power integrity and signal integrity have become first-order design constraints. Multi-gigabit data rates, shrinking voltage margins, and thousands of VDD/GND connections across dies, interposers, and bridges create tightly coupled power delivery networks. Simultaneous switching noise, voltage droop, frequency-dependent impedance, and parasitic coupling directly impact timing, reliability, and yield. The fundamental challenge lies in ensuring clean and reliable signal transmissions and stable power delivery across intricate systems.

Innovator3D IC Integrator uses a digital-twin data model targeted at the core workflow of 2.5 and 3D IC heterogeneous integration and acts as a central cockpit orchestrating:

  • mPower for accurate chip power models
  • Calibre xACT3D for high-fidelity resistance, inductance, capacitance, and substrate coupling extraction with ultra-fast, field-based through-silicon via modeling
  • Innovator3D IC Advanced Package Solvers for package-level electromagnetic analysis

This solution gives designers a higher confidence in signoff, faster time-to-market, and dramatically improved productivity through seamless collaboration between die and package design teams.

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