relatório técnico

Seamless integration of IC package design tools in mixed OS environments

Tempo de leitura: 5 minutos
A microprocessor chip

This white paper focuses on four primary configurations for deploying Innovator3D IC (i3D) and Xpedition Package Designer (xPD) in mixed OS environments:

  • VMs Side by Side on Hypervisor
  • VMs Side by Side on AWS
  • Linux VM on Windows Hardware
  • Windows VM on Linux Hardware

These configurations support forward and back annotation (FA/BA) workflows across platforms, maximizing compatibility and leveraging the respective strengths of Linux and Windows environments.

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