Fusing CMOS IC and MEMS design for IoT edge devices

Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved (Analog, digital, RF, and MEMS). But, creating an edge device that combines the electronics using the traditional CMOS custom IC design flow and a MEMS sensor on the same silicon die can seem impossible. In fact, many IoT edge devices combine multiple dies in a single package, separating electronics from the MEMS design.