Documento técnico

System-level reliability verification for 2.5D/3D ICs using Innovator3D IC and Calibre 3DPERC

Isometric view of semiconductor packaging evolution: 2.5D IC with green dies on interposer (left), circuit cross-section with routing patterns (center), and 3D stacked IC tower (right) against dark blue background.

The increasing demand for higher performance, lower power, and greater functionality in smaller packages has driven the rapid adoption of 2.5D and 3D Integrated Circuits (ICs). However, the inherent complexity of these multi-die architectures presents significant reliability verification challenges that traditional 2D flows cannot adequately address, particularly concerning electrostatic discharge (ESD) protection, heterogeneous die integration and inter-die connectivity.

This paper introduces a groundbreaking solution from Siemens EDA: the Innovator3D IC (i3D) flow seamlessly integrated with Calibre 3DPERC. This powerful methodology provides a specialized, end-to-end approach for system-level reliability verification of advanced 2.5D and 3D IC assemblies.

What you'll learn:

  • Why traditional 2D verification flows are fundamentally inadequate for 3D ICs
  • How the dual verification strategy (black-box vs. white-box) optimizes both speed and accuracy
  • The complete end-to-end workflow from design preparation to reliability verification
  • How to achieve consistent reliability verification across heterogeneous multi-vendor designs

Who should read this:

  • IC reliability verification engineers
  • Design engineers working with 2.5D and 3D ICs
  • IC design and verification teams

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