Innovator3D IC analysis
Unified system-level electrical analysis and signoff
In the complex world of 2.5D and 3D IC heterogeneous integration, traditional point-tool flows struggle to provide accurate system-level electrical analysis, leading to manual effort, data translation issues, and late-stage debugging.
Siemens EDA addresses these challenges with a unified flow that supports both early-stage and sign-off-quality system analysis, crucial for managing the intricacies of TSVs, micro-bumps, and complex packaging.
Our solution enables comprehensive signal integrity (SI), power integrity (PI), and IR-drop analysis across silicon, interposers, and advanced packaging.
By allowing users to select nets of interest and automatically stitching S-parameters into testbenches, Siemens tools like HyperLynx SI, HyperLynx PI, and mPower provide end-to-end channel performance evaluations, worst-case droop analysis, and IR-drop heatmaps.
This integrated approach supports early-stage and incremental design, allowing for the detection of bottlenecks and layout pathologies well before tape-out, ultimately reducing late-cycle surprises, shortening design cycles, and improving predictability and confidence in the final design.