Ficha Informativa
Xpedition Substrate Integrator
Key benefits of substrate integrator
Rapid planning, prototyping and optimization of 2.5/3D heterogeneously integrated die/chiplets based semiconductor package assemblies
System connectivity management and visualization with cross-domain pin/signal mapping/shorting and system-level logical verification
User-definable rules for custom optimization of pin and ball-out assignments
Single-window visualization and hierarchical management of multi- die/chiplet and substrate assemblies
Pin-based interface planning with or without nets
Extensive input and output data formats
System-level LVS/STA verification through Calibre® 3DSTACK
Integration with Xpedition Package Designer and Calibre, for detailed implementation, verification, and signoff