Xpedition IC Packaging VX.2.10 Fact Sheet

In this paper, you will learn about the key capabilities in the Xpedition IC Packaging VX.2.10 release. You will learn about performance and design capacity support for ultra-high pin count devices, system-level predictive SI/PI analysis during prototyping and planning, as well as how to streamline the co-existence of mixed vendor design flows.