Accelerate electronics cooling design — right inside your CAD tool

Design smarter, cooler electronics—directly in your CAD environment

The Simcenter FLOEFD Electronics Cooling Center Module brings together the power of FLOEFD and Flotherm to help you frontload thermal simulation earlier in the design process. Fully embedded in your CAD tool, it enables accurate in-context analysis of fluid flow and heat transfer—so you can reduce design iterations, cut prototyping costs, and ensure long-term reliability of your electronics.

By identifying thermal issues early, you can avoid costly late-stage redesigns and accelerate time-to-market. This streamlined workflow also fosters better collaboration across design teams by keeping simulation insights within the CAD environment, reducing errors and data translation challenges. The result is a more efficient development process that saves resources, minimizes risk, and delivers products that perform reliably under real-world conditions.

Download the fact sheet to see how this integrated solution simplifies thermal design while boosting speed, accuracy, and confidence in your results.