Bridging the verification gap in advanced packaging

In today's complex world of advanced packaging, integrating chiplets from multiple sources into a single platform presents significant verification challenges that traditional IC-centric tools can't address. This eBook, the fourth and final in the series, dives into the critical signoff stage of heterogeneous integration, revealing how to overcome the verification gap and ensure manufacturability and performance for your next-generation designs.

Learn how to achieve accurate and comprehensive package assembly verification, paving the way for successful chiplet implementation.

The final stage of heterogeneous integration: Preparing for implementation

In this eBook, the fourth and final in the series, we focus on the last stage in heterogeneous chip integration: signoff.

What you will learn:

• The critical "verification gap" in IC-package co-design and why traditional methods fall short for advanced chiplet integration.
• The essential role and benefits of Assembly Design Kits (ADKs) in enabling accurate and comprehensive package assembly verification (LVS).
• Key physical verification checks (DRC, LVS) required for complex 2.5D/3D IC assemblies, including interposer and chiplet connectivity.
• A detailed look at the final signoff and data export steps (9 & 10) within a robust heterogeneous integration methodology.
• Strategies for rigorously verifying multi-substrate assemblies with components sourced from different foundries and OSATs.

Download the eBook now to prepare your designs for successful implementation!