Accelerate your 3D IC design to manufacturing with an integrated toolchain

Moore's Law faces limitations as transistors approach physical miniaturization limits. 3D stacking of ICs shows promise but increases complexity in design and production. Siemens offers an integrated end-to-end toolchain that allows designers to move seamlessly through the design process while addressing these complexities. Our solution enables collaboration between ECAD and MCAD domains, provides thermal and structural simulation, and enhances productivity by up to 40x.