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3D IC Podcast episode 17 insights: Why every 3D IC needs a test vehicle before it hits production

Deliver 3D IC innovations faster

What's the true cost of skipping proper test vehicle validation? In the rapidly evolving world of semiconductor design, test vehicles serve as crucial tools for validating new technologies and manufacturing processes before they are released to full production. This comprehensive eBook explores the intricate world of test vehicles and daisy chain design testing in semiconductor manufacturing, drawing on decades of industry expertise and practical applications.

Download this eBook to gain expert insights from the 2025 Siemens EDA 3D IC podcast episode featuring Kendall Hiles, Sr. 3D IC Product Specialist at Siemens EDA. This eBook explores how test vehicles serve as risk mitigation tools, enabling manufacturers to validate complex designs, verify manufacturing processes, and ensure reliability without the substantial costs associated with full production runs. From basic daisy chain testing to sophisticated thermal and electrical validation, this eBook provides invaluable insights for anyone involved in 3D IC semiconductor design and manufacturing.

Key insights discussed

  • The current state of 3D IC integration
  • Understanding true 3D vs 2.5D integration
  • The economic drivers of 3D IC adoption
  • Technical drivers and tipping points
  • Future outlook: Methodology and mindset changes

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