Innovator3D IC solution suite

The Innovator3D IC™ solution suite enables “right first time” design and heterogeneous integration of chiplets into a high-performance integration platform. The solution suite helps companies predictably achieve their design and market window schedules by resolving the barriers of design complexity that impact design cycles, thereby accelerating designer productivity.

Overcome key challenges

Innovator3D IC focuses on common key challenges most semiconductor packaging design teams face. It helps team overcome these by:

• Enabling the design and heterogeneous integration of chiplets into a high-performance integration platform, right first time
• Overcoming the barriers of design complexity that impact design cycles
• Meeting design and market window schedules
• Accelerating designer productivity
• Delivering positive experience and cost of ownership
• Realizing designs that meet power performance area (PPA) and cost in the shortest predictable timeframe

Learn more about the solution suite.