Streamlining 3D IC design: Managing the design and its design IP

In the first four eBooks we focused on pathfinding and prototyping the design scenario using STCO co-design and early predictive multiphysics analysis. In eBooks number five and six, we pivoted to detailed physical implementation of the integration substrate. In eBook number seven, we focused on the process of early pre-layout and re-route pathfinding definition and the optimization of implementation strategies for chiplet-to-chiplet interfaces using the Universal Chiplet Interconnect Express (UCIeTM) protocol. In this eBook, the eighth and last in the series, we focus on the process of design data and design IP management, traceability, and revision control.