Xpedition® Package Designer (xPD) is a complete, powerful, and proven design solution for physical design and verification of advanced packages and 2.5 heterogeneous assemblies.
Key capabilities for package designer
- Fan out wafer level package (FOWLP) with mounted on organic BGA packages
- Comprehensive active and passive embedded devices including embedded bridges
- Patented auto-interactive ‘sketch routing’ technology
- Complex via arrays and ‘crankshafts’ easily defined and manipulated in design
- Accelerate routing of complex designs with routing groups
- Real-time dynamic routing in 2D and 3D views
- Dynamic timing delay tuning to meet performance specifications
- Geometry engine capable of checking complex process rules like metal balancing and density
- Partial and full package parasitic extraction to generate an IBIS model
- Dynamic integration with Calibre for verification signoff
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