WORKSHOP: An integrated simulation workflow from Chip to Data Center

This event is an opportunity to connect with industry experts, gain insights into the future of thermal management, and explore solutions that enhance system performance and reliability.

In the rapidly advancing landscape of AI computing and data growth, data centers are facing unprecedented power density challenges that exceed the capabilities of conventional cooling solutions. These thermal loads impact every facet of design, from the intricate layers of 3D integrated circuits to the full data center infrastructure.

We invite you to an exclusive experience focused on holistic thermal solutions—from chip-level modeling to full-scale data center performance. This event will explore cutting-edge techniques for optimizing thermal performance across every level of design.

Event Details

Location: Wed, June 11th, 2025 - 10:00 AM to 4:00 PM (PDT)

Siemens Digital Industries Software – Fremont Office

46885 Bayside Parkway – Building B – Fremont, CA 94538

Guest Speaker

Andy Young, PhD - CTO of Asperitas

Azita Soleymani, PhD - Founder & CTO of HeatSync

Advancing Thermal Management

What you will learn

  • Holistic Understanding of thermal, electrical, and mechanical design from chip to data center infrastructures.
  • Heterogeneous Integration strategies for chiplet-based designs, including planning, modeling, and co-simulation.
  • Assessment of cooling technologies using 1D to 3D CFD simulation with fully integrated workflows.
  • A comprehensive digital twin to provide insights across the entire lifecycle, creating a live connection between virtual and real world, transforming IoT data into engineering insights.
  • Reduce operational and commissioning costs via Condition monitoring.
  • Integrate design databases and leverage a planning cockpit to explore complex 2.5D/3D IC package architectures and incorporate die level thermal modeling earlier in the design process.

If you’re designing for the future, thermal must be part of your strategy from Day 1. Siemens’ holistic approach optimizes thermal performance from chip to large-scale environments, streamlining workflows, improving accuracy, and accelerating innovation for even the most complex applications

Space is limited—reserve your spot today.

Let’s redefine the future of data centers.

See you in Fremont.