Streamlining 3D IC Design with Innovator3D IC Integrator

Siemens' Innovator3D IC Integrator Release 2604.0002 significantly advances 3D IC design and chiplet integration workflows. This release accelerates early design planning and prototyping, offering enhanced flexibility with layer stackup editing and more precise interconnect resistivity reporting. Key productivity improvements include automated pin renumbering with separate control for top and bottom sides and support for blackbox device creation.