System-in-Package Technology: Cost-Effective Heterogeneous Integration

Coordinated planning during the early stages of silicon floor-planning, before elements within the chip are fixed, can result in an optimized silicon/package interface that reduces cycle time and costs while enhancing overall device performance. Through cost-effective heterogeneous integration of System-in-Package (SiP) technology, companies can reach their design objectives for quality, reliability, productivity, and time-to-market.