Due to the increasing availability of Multi Beam Mask Writers (MBMW) and the associated wafer lithography benefits, efficient handling of curvilinear mask shapes in the post tape-out flow becomes increasingly important. The presence of complex curvilinear mask shapes generated by Inverse Lithography Technology (ILT), or similar techniques requires new features and algorithms, especially in the context of applying Mask Process Correction (MPC).
This paper discusses the status of Curvilinear MPC (CLMPC) and gives a brief outlook into the near future of handling curvilinear mask shapes in the post tape-out flow. A summary of MRC requirements for incoming data and implications for mask inspection are included as well to put CLMPC into the right context. Further, approaches for CLMPC file size compaction along with new methods of data representation based on native curve formats are also discussed. A version of this paper was published in the Proceedings of SPIE 12472.
The Calibre team is actively developing solutions to unlock the advantages of CL and to deal with some of the accompanying challenges. We have developed a suite of efficient mask MPC, OPC, and verification solutions that will help in the transition to curvilinear masks, whether for intrinsically curvilinear patterns needed in Silicon Photonics, or what we have “traditionally” viewed as rectilinear designs for logic or memory.
The Calibre solutions include: