Securing tape-out of CMOS IC with integrated power amplifiers using Calibre 3DThermal - LG Electronics Finland lab

In today's demanding semiconductor landscape, thermal management stands as a critical challenge in CMOS ICs that contain power amplifiers. This presentation showcases implementation of Calibre 3DThermal, demonstrating its pivotal role in achieving a successful tape-out of a bulk CMOS design with power amplifier integration. Calibre 3DThermal offers a robust methodology spanning from early design phases through post-silicon validation. Through its powerful analytical capabilities, we achieved unprecedented visibility into thermal distributions across critical design blocks. The tool's debugging features provided both detailed insights and high-level thermal perspectives, enabling temperature analysis around the power amplifier and its impact on surrounding crucial components. The correlation between simulated results and actual die measurements demonstrated good accuracy, confirming Calibre 3DThermal's effectiveness as a trusted thermal analysis solution.