Meeting future performance demands through packaging

Presented at User2User 2024 North America by Jeff Cain of Chipletz, this session will highlight the innovative technology enabling Chipletz to deliver some of the industry’s largest and most complex chiplet-based designs. It will illustrate the scaling challenges presented by the number of diverse, modular die on large substrates along with their power delivery requirements. The session will present a new approach enabling design teams to meet tape-out schedules while managing ever-increasing complexity. It will illustrate the benefits of incorporating physical circuit reuse for inter-chip sub-system design as well as complex via structures for differential-pair routing and PDN interconnect