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기술 개요
VX2.6 XSI HyperlynxLineSim for pre-route SI exploration
예상 시청 시간: 1분
Continuing our leadership in High-density advanced packaging with their VX.2.6 Xpedition platform release.
For more information on Xpedition Substrate Integrator, please click
here.
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제품
Xpedition IC Packaging