팩트 시트
Xpedition IC Packaging VX.2.12 Fact Sheet
예상 소요 시간: 2분
In this paper, you will learn about the key capabilities in the Xpedition IC Packaging VX.2.12 release. You will learn about greater workflow customization through additional automation, optimized ground return paths, simulation and analysis results import, ASIC/chiplet/interposer connectivity modeling, and 100+Gbit differential signal performance.