Analysis and prediction of soft materials like pressure-sensitive adhesives utilizing simcenter culgi modeling
Based on solid physics, the Simcenter Culgi coarse-grained molecular thermodynamics simulation methodology handles micro and macroscopic phase separation, reactions, and mechanics without calibration. Novel microscopic phase behavior calculations in polymeric materials are evaluated and forecasted in this white paper for nanometer-scale structures in pressure-sensitive adhesives (PSAs).
Simcenter Culgi software benefits complex soft materials analysis for the modeling of pressure-sensitive adhesives
On a scale of 1-100 nm, the modeling library can handle cross-linked systems, reactive systems, evaporating or demixing systems, and any combination thereof, combining quantum, molecular, and coarse-grained simulations, thermodynamics, and chemical informatics. Simcenter Culgi is state-of-the-art multiscale modeling software.
Simcenter Culgi used in the modeling of pressure-sensitive adhesives has advantages. This software solution:
Models any chemical mixture/ additive or context
Includes a coarse-grained 3D additive and material model
Determines each chemical's thermodynamic distribution in minutes
Calculates crosslink density, entanglements, and mechanics using 3D particle-based simulation models
Download and read the whitepaper to learn more.